Solid Logic Technology: Versatile, high-performance microelectronics

A new microelectronics packaging technique, called Solid logic Technology (SLT), utilizes silicon planar glass-encapsulated transistors and diodes, and graphic arts techniques for producing high-quality, passive components having tight tolerances. The result is a process permitting the low-cost realization of a variety of versatile, high-performance circuit modules. The salient features of SLT are described: the unique form of the semiconductor devices, the module fabriaa-tion process, and some performance results. In addition, insight is provided to the range of components that may be fabricated with this technology, i.e., inductors, capacitors and high-power transistors. Examples are shown of specific high-speed, high-density and complex circuit packages.